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Question: Failure times of silicon wafer microchips. Researchers at National Semiconductor experimented with tin-lead solder bumps used to manufacture silicon wafer integrated circuit chips (International Wafer-Level Packaging Conference, November 3–4, 2005). The failure times of the microchips (in hours) were determined at different solder temperatures (degrees Celsius). The data for one experiment are given in the table. The researchers want to predict failure time (y) based on solder temperature (x).

  1. Construct a scatterplot for the data. What type of relationship, linear or curvilinear, appears to exist between failure time and solder temperature?
  2. Fit the model,E(y)=β0+β1x+β2x2, to the data. Give the least-squares prediction equation.
  3. Conduct a test to determine if there is upward curvature in the relationship between failure time and solder temperature. (use.α=0.05)

Short Answer

Expert verified

Answer:

  1. It appears that there is a curvilinear relationship between failure time and solder temperature. From the scatterplot, it appears that there is a negative relationship between failure time and solder temperature which is indicated by the downward-sloping curve.
  2. From the excel output, the values for intercept and slope coefficient are calculated. Therefore, the least square prediction equation isy^=154242.9-1908.85x+5.928945x2
  3. At 95% confidence level, it is concluded that β2>0.This means that the parabola has an upward curvature.

Step by step solution

01

Scatterplot

Time to failure (Y)

Temperature(X)


200

165

27225

200

162

26244

1200

164

26896

500

158

24964

600

158

24964

750

159

25281

1200

156

24336

1500

157

24649

500

152

23104

500

147

21609

1100

149

22201

1150

149

22201

3500

142

20164

3600

142

20164

3650

143

20449

4200

133

17689

4800

132

17424

5000

132

17424

5200

134

17956

5400

134

17956

8300

125

15625

9700

123

15129

It appears that there is a curvilinear relationship between failure time and solder temperature. From the scatterplot, it appears that there is a negative relationship between failure time and solder temperature which is indicated by the downward-sloping curve.

02

Least squares prediction equation 

SUMMARY OUTPUT

















Regression Statistics








Multiple R

0.970315








R Square

0.941512








Adjusted R Square

0.935355








Standard Error

688.1366








Observations

22

















ANOVA









df

SS

MS

F

Significance F




Regression

2

144830279.6

72415140

152.9256

1.94E-12




Residual

19

8997106.744

473531.9






Total

21

153827386.4













Coefficients

Standard Error

t Stat

P-value

Lower 95%

Upper 95%

Lower 95.0%

Upper 95.0%

Intercept

154242.9

21868.47384

7.053209

1.03E-06

108471.7

200014.2

108471.7

200014.2

Temperature(X)

-1908.85

303.6635562

-6.28607

4.92E-06

-2544.43

-1273.28

-2544.43

-1273.28


5.928945

1.04764072

5.659331

1.86E-05

3.736208

8.121683

3.736208

8.121683

From the excel output, the values for intercept and slope coefficient are calculated. Therefore, the least square prediction equation isy^=154242.9-1908.85x+5.928945x2

03

Significance of β2

H0:β2=0Ha:β2>0

Here, t-test statistic

=β2^sβ2=5.9289451.047641=5.659

Value oft0.05,22is 1.717

is rejected if t statistic >t0.05,385. For α=0.05, since t >localid="1649842001962" t0.05,199

Sufficient to reject at 95% confidence interval.

Therefore,β2>0

This means that the parabola has an upward curvature.

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