You have been asked to determine the feasibility of using an impinging jet in
a soldering operation for electronic assemblies. The schematic illustrates the
use of a single, round nozzle to direct high-velocity, hot air to a location
where a surface mount joint is to be formed.
For your study, consider a round nozzle with a diameter of \(1 \mathrm{~mm}\)
located a distance of \(2 \mathrm{~mm}\) from the region of the surface mount,
which has a diameter of \(2.5 \mathrm{~mm}\).
(a) For an air jet velocity of \(70 \mathrm{~m} / \mathrm{s}\) and a temperature
of \(500^{\circ} \mathrm{C}\), estimate the average convection coefficient over
the area of the surface mount.
(b) Assume that the surface mount region on the printed circuit board (PCB)
can be modeled as a semi-infinite medium, which is initially at a uniform
temperature of \(25^{\circ} \mathrm{C}\) and suddenly experiences convective
heating by the jet. Estimate the time required for the surface to reach
\(183^{\circ} \mathrm{C}\). The thermophysical properties of a typical solder
are \(\rho=8333 \mathrm{~kg} / \mathrm{m}^{3}, c_{p}=188 \mathrm{~J} /
\mathrm{kg} \cdot \mathrm{K}\), and \(k=\) \(51 \mathrm{~W} / \mathrm{m} \cdot
\mathrm{K}\).