/*! This file is auto-generated */ .wp-block-button__link{color:#fff;background-color:#32373c;border-radius:9999px;box-shadow:none;text-decoration:none;padding:calc(.667em + 2px) calc(1.333em + 2px);font-size:1.125em}.wp-block-file__button{background:#32373c;color:#fff;text-decoration:none} Problem 98 The radiation heat gage shown in... [FREE SOLUTION] | 91Ó°ÊÓ

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The radiation heat gage shown in the diagram is made from constantan metal foil, which is coated black and is in the form of a circular disk of radius \(R\) and thickness \(t\). The page is located in an evacuated enclosure. The incident radiation flux absorbed by the foil, \(q_{n}^{*}\) diffuses toward the cuter circumference and into the larger copper ring, which acts as a heat sink at the constant temperature \(T(R)\). Tuo copper lead wires are attached to the center of the foil and to the ring to complete a thermocouple circuit that allows for measurement of the temperature difference between the foil center and the foil edge, \(\Delta T=T(0)-T(R)\). Obtain the differential equation that determines \(T(r)\), the temperature distribution in the foil, under steady- state conditions. Solve this equation to obtuin an expression relating \(\Delta T\) to \(q^{\prime \prime}\). You may neglect radiation exchange between the foil and its surroundings.

Short Answer

Expert verified
\(\Delta T = \frac{q_n^* R^2}{4k}\), expressing temperature difference in terms of flux.

Step by step solution

01

Identify Heat Equation for Cylinder

In this problem, the heat transfer occurs radially across a thin circular disk. In cylindrical coordinates, the radial heat conduction equation is used due to symmetry and steady-state conditions. The equation is given by \[\frac{d}{dr}\left(k r \frac{dT}{dr}\right) + q'' = 0\]with \(k\) being the thermal conductivity of constantan and \(q''\) the heat generation per unit volume, here assumed as the flux \(q_n^*\).
02

Simplify the Heat Equation

Since the problem is at a steady-state and the thickness is small, assume that there is no heat generation within the foil itself, i.e. \(q'' = 0\). Therefore, the equation simplifies to:\[\frac{d}{dr}\left(k r \frac{dT}{dr}\right) = 0\]
03

Integrate the Simplified Equation

Integrate the simplified equation once with respect to \(r\):\[k r \frac{dT}{dr} = C_1\]where \(C_1\) is an integration constant. Then solve for \(\frac{dT}{dr}\):\[\frac{dT}{dr} = \frac{C_1}{k r}\]
04

Integrate Again to Find Temperature Distribution

Integrate again to find the temperature \(T(r)\):\[T(r) = \frac{C_1}{k} \ln r + C_2\]where \(C_2\) is another integration constant.
05

Apply Boundary Conditions

Apply the boundary conditions to determine constants \(C_1\) and \(C_2\). At \(r = R\), the temperature \(T(R)\) is constant:\[T(R) = \frac{C_1}{k} \ln R + C_2 = T(R)\]At \(r = 0\) (center), the temperature \(T(0)\):Due to symmetry, \(\frac{dT}{dr}\) is finite which implies \(C_1 = 0\). Hence, \(\Delta T = T(0) - T(R)\). The linear profile equates to gradient \(\frac{dT}{dr} = \frac{T(0) - T(R)}{R}\) with flux causing \(C_1 = q_n^* R / k\).
06

Express Temperature Difference

Substitute back into the simplified gradient equation to express \(\Delta T\) in terms of flux:\[\Delta T = T(0) - T(R) = \frac{q_n^* R^2}{4k}\]This gives the relationship between temperature difference and absorbed heat flux.

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Key Concepts

These are the key concepts you need to understand to accurately answer the question.

Radiation Heat Transfer
Radiation heat transfer deals with the energy exchange between surfaces at different temperatures, without the need for a medium. In the case of the radiation heat gage exercise, the foil disk absorbs radiative energy. This energy is then transferred towards the larger copper ring. Radiation heat transfer is less intuitive than conduction or convection, as it depends heavily on the temperature and emissivity of the surfaces. Here, the foil absorbs the incident radiation flux, denoted as \(q_{n}^{*}\), which must be accounted for in solving the foil's temperature distribution. This type of heat transfer is crucial in environments such as vacuum, where other modes like convection are negligible.
Cylindrical Coordinates
In the context of the problem, cylindrical coordinates are used because the heat transfer occurs radially in the circular foil. This coordinate system includes radius \(r\), angle \(\theta\), and height \(z\). For radial problems, the height doesn't come into play, simplifying the analysis to two dimensions. The radial heat conduction equation simplifies for this symmetric problem under steady-state conditions. Using cylindrical coordinates, you can focus on the radial dimension, reducing complexity compared to Cartesian coordinates. This approach results in the set of mathematical equations, such as \(\frac{d}{dr}\left(k r \frac{dT}{dr}\right) + q'' = 0\), which help in modeling how the temperature varies from the center to the edge of the disk.
Temperature Distribution
Temperature distribution in an object tells us how temperature varies across it. For the radiation heat gage, finding the temperature distribution \(T(r)\) was key, as it helped relate the temperature difference \(\Delta T = T(0) - T(R)\) to the absorbed heat flux \(q^{\prime\prime}\). Solving the heat conduction equation gives insight into the steady-state temperature profile through methods like integration and applying boundary conditions. The equation integrates to \(T(r) = \frac{C_1}{k} \ln r + C_2\), where \(C_1\) and \(C_2\) are integration constants determined by boundary conditions. By understanding this temperature profile, we gain valuable information about how materials respond to radiative heat and how thermal gradients can influence structural and functional aspects of materials.

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Most popular questions from this chapter

A 2-mm-diameter electrical wire is insulated by a 2 -mm-thick rubberized sheath \((k=0.13 \mathrm{~W} / \mathrm{m} \cdot \mathrm{K})\), and the wirc/sheath interface is characterized by a thermal contuct resistance of \(R_{t,}^{\prime \prime}=3 \times 10^{-4} \mathrm{~m}^{2} \cdot \mathrm{K} / \mathrm{W}\). The convection heat transfer coefficient at the outer surface of the sheath is \(10 \mathrm{~W} / \mathrm{m}^{2} \cdot \mathrm{K}\), and the tempenature of the ambient air is \(20^{\circ} \mathrm{C}\). If the temperature of the insulation may not exceed \(50^{\circ} \mathrm{C}\), what is the maximum allowable electrical power that may be dissipated per unit length of the conductor? What is the critical radius of the insulation?

A thin clectrical heater is inserted between a long circular rod and a concentric tube with inner and outer radii of 20 and \(40 \mathrm{~mm}\). The rod (A) has a thermal conductivity of \(k_{A}=0.15 \mathrm{~W} / \mathrm{m}+\mathrm{K}\). while the tube (B) has a thermal conductivity of \(k_{\mathrm{B}}=1.5 \mathrm{~W} / \mathrm{m} \cdot \mathrm{K}\) and its cuter surface is subjected to convection with a fluid of temperature \(T_{w}=-15^{\circ} \mathrm{C}\) and heat transfer coefficient \(50 \mathrm{~W} / \mathrm{m}^{2} \cdot \mathrm{K}\). The thermal contact resistance betueen the cylinder surfaces and the heater is negligible. (a) Determine the electrical power per unit length of the cylinders (W/m) that is required to maintain the outer surface of eylinder \(\mathrm{B}\) at \(5^{\circ} \mathrm{C}\). (b) What is the temperature at the center of cylinder A?

A straight fin fabricated from 2024 aluminum alloy \((k=185 \mathrm{~W} / \mathrm{m}-\mathrm{K})\) has a base thickness of \(t=3 \mathrm{~mm}\) and a length of \(L=15 \mathrm{~mm}\). Its base temperature is \(T_{b}=100^{\circ} \mathrm{C}\), and it is exposed to a fluid for which \(T_{w}=20^{\circ} \mathrm{C}\) and \(h=50 \mathrm{~W} / \mathrm{m}^{2} \cdot \mathrm{K}\). For the foregoing conditions and a fin of unit widh, compare the fin heat rate, efficiency, and volume for rectangular, triangular, and parabolic profiles.

In a manufacturing process, as transparent film is being bonded to a substrate as shown in the sketch. To cure the bond at a temperature \(T_{\text {ty }}\) a radiant source is used to provide a heat flux \(q_{i}^{\pi}\left(\mathrm{W} / \mathrm{m}^{2}\right)\), all of which is absorbed at the bonded surface. The back of the substrate is maintained at \(T_{1}\) while the free surface of the film is exposed to air at \(T_{m}\) and a convection heat transfer coefficient \(h\). (a) Show the thermal circuit representing the steady-state heat transfer situation, Be sure to label all elements, nodes, and heat rates. Leave in symbolic form. (b) Assume the following conditions: \(T_{w}=20^{\circ} \mathrm{C}, h=\) \(50 \mathrm{~W} / \mathrm{m}^{2} \cdot \mathrm{K}_{\text {, }}\) and \(T_{1}=30^{\circ} \mathrm{C}\). Calculate the heat flux \(q_{0}^{\prime}\) that is required to maintain the bonded surface at \(T_{0}=60^{\circ} \mathrm{C}\). (c) Compute and plot the required heat flux as a function of the film thickness for \(0 \leq L_{y} \leq 1 \mathrm{~mm}\). (d) If the film is not transparent and all of the radiant heat flux is absorbed at its upper surface, determine the heat flux required to achieve bonding. Plot your results as a function of \(L_{f}\) for \(0 \leq L_{f} \leq 1 \mathrm{~mm}\).

As a means of enhancing heat transfer from highperformance logic chips, it is common to attach a heot sink to the chip surface in order to increase the surface area available for convection heat transfer. Because of the ease with which it may be manufactured (by taking orthogonal sawcuts in a block of material), an attmctive option is to use a heat sink consisting of an atmy of square fins of width w on s side. The spacing between adjoining fins would be determined by the width of the sawblade, with the sum of this spacing and the fan width designated as the fin pitch \(S\). The method by which the hent sink is joined to the chip would detesmine the interfacial contact resistance, \(R_{\mathcal{U}^{*}}^{*}\) Consider a square chip of width \(W_{c}=16 \mathrm{~mm}\) and conditions for which cooling is provided by a diclectric liquid with \(T_{w}=25^{\circ} \mathrm{C}\) and \(h=1500 \mathrm{~W} / \mathrm{m}^{2} \cdot \mathrm{K}\). The heat sink is fahricated from copper \((k=400\) Whe \(\mathrm{K})\), and its characteristic dimensions are \(w=0.25\) \(\operatorname{mmn}_{,} S=0.50 \mathrm{~mm}, L_{y}=6 \mathrm{~mm}\), and \(L_{1}=3 \mathrm{~mm}\). The preccribed values of \(w\) and \(S\) represent minima imposed by manufacturing constraints and the need to maintain adequate flow in the passages between fins. (a) If a metallurgical joint provides a contact resistance of \(R_{\mathrm{W}}^{*}=5 \times 10^{-6} \mathrm{~m}^{2}+\mathrm{K} / \mathrm{W}\) and the maximum allowable chip temperature is \(85^{\circ} \mathrm{C}\), what is the maximum allowable chip power dissipation \(q, ?\) Assume all of the heat to be transferred through the heat sink. (b) It may be possible to increase the heat dissipation by increasing \(w\), subject to the constraint that \((S-w) \geq 0.25 \mathrm{~mm}\), and/or increasing \(L_{f}\) (suhject to manufacturing constraints that \(L_{y} \leq 10 \mathrm{~mm}\). Assess the effect of such changes.

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