/*! This file is auto-generated */ .wp-block-button__link{color:#fff;background-color:#32373c;border-radius:9999px;box-shadow:none;text-decoration:none;padding:calc(.667em + 2px) calc(1.333em + 2px);font-size:1.125em}.wp-block-file__button{background:#32373c;color:#fff;text-decoration:none} Problem 5 The walls of a refrigerator are ... [FREE SOLUTION] | 91Ó°ÊÓ

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The walls of a refrigerator are typically constructed by sandwiching a layer of insulation between shect metal pancls. Consider a wall made from fiberglass insulation of thermal conductivity \(k_{1}=0.046 \mathrm{~W} / \mathrm{m}-\mathrm{K}\) and thickness \(I_{-}=50 \mathrm{~mm}\) and steel parels, each of thermal conductivity \(k_{p}=60\) W/m \(: \mathrm{K}\) and thickness \(L_{7}=3 \mathrm{~mm}\). If the wall separates refrigerated air at \(T_{x, j}=4^{\circ} \mathrm{C}\) from ambient air at \(T_{2,0}=25^{\circ} \mathrm{C}\), what is the heat gain per unit surface area? Cocfficicnts associated with natural convection at the inner and outer surfaces may be approximated as \(h_{y}=h_{g}=5 \mathrm{~W} / \mathrm{m}^{2} \cdot \mathrm{K}\).

Short Answer

Expert verified
The heat gain per unit surface area is approximately 14.13 W/m².

Step by step solution

01

Establish Total Resistance Network

First, identify the different layers in the refrigerator wall that contribute to thermal resistance. There are three primary elements: the inner steel panel, the fiberglass insulation, and the outer steel panel. Along with these, we need to consider the inner and outer convection resistances due to air.
02

Calculate Conductive Resistances

For conductive resistance in each layer, use the formula \[ R = \frac{L}{k \cdot A} \]where \( L \) is the thickness, \( k \) is the thermal conductivity, and \( A \) is the area. However, since we want the heat gain per unit area, sets \( A = 1 \ \text{m}^2 \). Calculate for steel:\[ R_{ps} = \frac{0.003}{60} = 0.00005 \, \text{m}^2 \, \cdot \text{K/W} \] and for fiberglass:\[ R_{insulation} = \frac{0.05}{0.046} = 1.087 \, \text{m}^2 \, \cdot \text{K/W} \].
03

Calculate Convective Resistances

For convective resistance, use the formula \[ R_c = \frac{1}{h \cdot A} \]. Again, \( A = 1 \ \text{m}^2 \), soInner surface:\[ R_{c1} = \frac{1}{5} = 0.2 \, \text{m}^2 \, \cdot \text{K/W} \] Outer surface:\[ R_{c2} = \frac{1}{5} = 0.2 \, \text{m}^2 \, \cdot \text{K/W} \].
04

Calculate Total Resistance

Add up all the resistances to get the total resistance.\[ R_{total} = R_{c1} + R_{ps} + R_{insulation} + R_{ps} + R_{c2} \] \[ R_{total} = 0.2 + 0.00005 + 1.087 + 0.00005 + 0.2 = 1.4871 \, \text{m}^2 \, \cdot \text{K/W} \]
05

Calculate Heat Gain per Unit Surface Area

Use the formula for heat transfer \[ Q = \frac{(T_2 - T_1)}{R_{total}} \]where \( T_2 = 25^\circ C \) and \( T_1 = 4^\circ C \).\[ Q = \frac{25 - 4}{1.4871} \approx 14.13 \, \text{W/m}^2 \].

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Key Concepts

These are the key concepts you need to understand to accurately answer the question.

Thermal Conductivity
Understanding thermal conductivity is crucial when analyzing heat transfer in materials. It tells us how well a material can conduct heat. The more conductive a material, the better it is at transferring heat from one side to the other.
In this exercise, the refrigerator wall is constructed using two materials with different thermal conductivities: steel and fiberglass. Steel has a very high conductivity of 60 W/m·K, meaning it transfers heat efficiently, while fiberglass has a low conductivity of 0.046 W/m·K, indicating it's a good insulator.
The equation for calculating conductive resistance is given by:\[ R = \frac{L}{k \cdot A} \]where:
  • \(R\) is the resistance,
  • \(L\) is the thickness of the material,
  • \(k\) is the thermal conductivity,
  • \(A\) is the area.
Usually, thermal conductivity is a material's intrinsic property and often used to design barriers for efficient insulation, like in our refrigerator wall.
Convective Resistance
Convective resistance is another critical player in heat transfer, particularly when there's a fluid—like air—involved. It arises due to the movement of the fluid at the surface of a solid. In this setting, the convective resistance depends largely on the heat transfer coefficient, \( h \).
The heat transfer rates are influenced by both the convection at the surfaces of the refrigerator wall and the internal and external ambient temperatures. The formula for convective resistance is:\[ R_c = \frac{1}{h \cdot A} \]Where:
  • \(R_c\) is the convective resistance,
  • \(h\) is the heat transfer coefficient,
  • \(A\) is the area.
In the exercise, both the internal and external surfaces have a convective heat transfer coefficient of 5 W/m²·K. Their corresponding convective resistances were essential for determining the total thermal resistance, thereby affecting how much heat flows into the refrigerator.
Refrigeration Engineering
Refrigeration engineering involves designing systems that manage and control temperature by removing heat from a designated area. The primary goal is to keep the inside of a refrigerator cool despite the warmer external climate.
The display wall of a refrigerator epitomizes the application of refrigeration engineering principles. Using both insulation materials and layers as combined with inner and outer convective resistancies can minimize heat gain, crucial for energy efficiency.
The overall heat gain per unit area in a refrigerator wall can be calculated by:\[ Q = \frac{(T_2 - T_1)}{R_{total}} \]where:
  • \(Q\) is the heat gain,
  • \(T_2\) and \(T_1\) are the ambient and refrigerator temperatures, respectively,
  • \(R_{total}\) encompasses all resistances to heat flow.
Each element of the refrigerator's wall is meticulously chosen to ensure that the least possible amount of heat gets inside, either through conduction or convection.

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Most popular questions from this chapter

A spherical vessel used as a reactor for producing pharmaceuticals has a 10 -mam-thick stainless steel wall \((k=\) \(17 \mathrm{~W} / \mathrm{m} \cdot \mathrm{K})\) and an inner diameter of \(1 \mathrm{~m}\). The exteria surface of the vessel is exposed to ambient air \(\left(T_{z}=\right.\) \(25^{\circ} \mathrm{C}\) ) for which a convection coefficient of \(6 \mathrm{~W} / \mathrm{m}^{2}+\mathrm{K}\) may be assumed. (a) During steady-state operation, an inner surfact temperature of \(50^{\circ} \mathrm{C}\) is maintained by enengy geneated within the reactor. What is the heat loss from the vessel? (b) If a 20-mm-thick layer of fiberglass insulation \((k=\) \(0.040 \mathrm{~W} / \mathrm{m}\) - K) is applied to the exterior of the ve sel and the rate of thermal energy generation is inchanged, what is the inner surface temperature of the vessel?

A hollow aluminem sphere, with an clectrical heater in the center, is used in tests to determine the thermal conductivity of insulating materials. The inner and outer radii of the sphere are \(0.15\) and \(0.18 \mathrm{~m}\), respectively. and testing is done under steady-state conditions with the inner surface of the aluminum maintained at \(250^{\circ} \mathrm{C}\). In a particular test, a spherical shell of insulation is cast on the outer surface of the sphere to a thickness of \(0.12 \mathrm{~m}\). The system is in a roorn for which the air temperature is \(20^{\circ} \mathrm{C}\) and the convection cocfficient at the outer surface of the insulation is \(30 \mathrm{~W} / \mathrm{m}^{2}+\mathrm{K}\). If \(80 \mathrm{~W}\) are dissipated by the heater under steady-state conditions, what is the thermal conductivity of the insulation?

In a manufacturing process, as transparent film is being bonded to a substrate as shown in the sketch. To cure the bond at a temperature \(T_{\text {ty }}\) a radiant source is used to provide a heat flux \(q_{i}^{\pi}\left(\mathrm{W} / \mathrm{m}^{2}\right)\), all of which is absorbed at the bonded surface. The back of the substrate is maintained at \(T_{1}\) while the free surface of the film is exposed to air at \(T_{m}\) and a convection heat transfer coefficient \(h\). (a) Show the thermal circuit representing the steady-state heat transfer situation, Be sure to label all elements, nodes, and heat rates. Leave in symbolic form. (b) Assume the following conditions: \(T_{w}=20^{\circ} \mathrm{C}, h=\) \(50 \mathrm{~W} / \mathrm{m}^{2} \cdot \mathrm{K}_{\text {, }}\) and \(T_{1}=30^{\circ} \mathrm{C}\). Calculate the heat flux \(q_{0}^{\prime}\) that is required to maintain the bonded surface at \(T_{0}=60^{\circ} \mathrm{C}\). (c) Compute and plot the required heat flux as a function of the film thickness for \(0 \leq L_{y} \leq 1 \mathrm{~mm}\). (d) If the film is not transparent and all of the radiant heat flux is absorbed at its upper surface, determine the heat flux required to achieve bonding. Plot your results as a function of \(L_{f}\) for \(0 \leq L_{f} \leq 1 \mathrm{~mm}\).

An electrical current of 700 A flows through a stainless steel cable having a diameter of \(5 \mathrm{~mm}\) and an electrical resistance of \(6 \times 10^{-4} \mathrm{\Omega} / \mathrm{m}\) (i.e., per meter of cable length). The cable is in environment having a temperature of \(30^{\circ} \mathrm{C}\), and the total coefficient associated with convection and radiation between the cable and the environment is approximately \(25 \mathrm{~W} / \mathrm{m}^{2} \cdot \mathrm{K}\). (a) If the cable is bare, what is its surface temperature? (b) If a very thin coating of electrical insulation is applied to the cable, with a contact resistance of \(0.02 \mathrm{~m}^{2}+\mathrm{K} / \mathrm{W}\), what are the insulation and cable surface temperatures? (c) There is some concern about the ability of the insulation to withstand elevated temperatures. What thickness of this insulation \((k=0.5 \mathrm{~W} / \mathrm{m} \cdot \mathrm{K})\) will yield the lowest value of the maximum insulation temperature? What is the valie of the maximum temperature when the thickness is used?

As a means of enhancing heat transfer from highperformance logic chips, it is common to attach a heot sink to the chip surface in order to increase the surface area available for convection heat transfer. Because of the ease with which it may be manufactured (by taking orthogonal sawcuts in a block of material), an attmctive option is to use a heat sink consisting of an atmy of square fins of width w on s side. The spacing between adjoining fins would be determined by the width of the sawblade, with the sum of this spacing and the fan width designated as the fin pitch \(S\). The method by which the hent sink is joined to the chip would detesmine the interfacial contact resistance, \(R_{\mathcal{U}^{*}}^{*}\) Consider a square chip of width \(W_{c}=16 \mathrm{~mm}\) and conditions for which cooling is provided by a diclectric liquid with \(T_{w}=25^{\circ} \mathrm{C}\) and \(h=1500 \mathrm{~W} / \mathrm{m}^{2} \cdot \mathrm{K}\). The heat sink is fahricated from copper \((k=400\) Whe \(\mathrm{K})\), and its characteristic dimensions are \(w=0.25\) \(\operatorname{mmn}_{,} S=0.50 \mathrm{~mm}, L_{y}=6 \mathrm{~mm}\), and \(L_{1}=3 \mathrm{~mm}\). The preccribed values of \(w\) and \(S\) represent minima imposed by manufacturing constraints and the need to maintain adequate flow in the passages between fins. (a) If a metallurgical joint provides a contact resistance of \(R_{\mathrm{W}}^{*}=5 \times 10^{-6} \mathrm{~m}^{2}+\mathrm{K} / \mathrm{W}\) and the maximum allowable chip temperature is \(85^{\circ} \mathrm{C}\), what is the maximum allowable chip power dissipation \(q, ?\) Assume all of the heat to be transferred through the heat sink. (b) It may be possible to increase the heat dissipation by increasing \(w\), subject to the constraint that \((S-w) \geq 0.25 \mathrm{~mm}\), and/or increasing \(L_{f}\) (suhject to manufacturing constraints that \(L_{y} \leq 10 \mathrm{~mm}\). Assess the effect of such changes.

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